Back to results
US 6,645,844 B2Granted
Methods for high density direct connect LOC assembly
AssigneeMicron Technology, Inc.
InventorTrung T. Doan
Life of this patent
Estimating the term…
Abstract
An apparatus and method for attaching a semiconductor die to a lead frame wherein the electric contact points of the semiconductor die are relocated to the periphery of the semiconductor die through a plurality of conductive traces. A plurality of leads extends from the lead frame over the conductive traces proximate the semiconductor die periphery and directly attaches to and makes electrical contact with the conductive traces in a LOC arrangement. Alternately, a connector may contact a portion of the conductive trace to make contact therewith.
Claims37
A method of manufacturing a semiconductor die, comprising:
- forming a semiconductor die having a periphery and an active surface having at least one electric contact point;
- and
- forming at least one conductive trace directly on a portion of said active surface of said semiconductor die, said at least one conductive trace comprising a first end electrically contacting at least a portion of said at least one electric contact point of said semiconductor die and a second end terminating adjacent a portion of said semiconductor die periphery for exposing a portion of said at least one conductive trace at said portion of said periphery of said semiconductor die, said at least one conductive trace comprising an extruded viscous conductive material onto said semiconductor die active surface between said at least one electric contact point of said semiconductor die making electrical contact therewith and said portion of said periphery of said semiconductor die.
A method of manufacturing a semiconductor die on a wafer, comprising:
- forming a plurality of semiconductor dice on said wafer, at least one semiconductor die having a periphery and an active surface having a plurality of contact points;
- and
- forming at least one conductive trace directly on a portion of said active surface of said at least one semiconductor die, said at least one conductive trace comprising a first end electrically contacting at least a portion of at least one electric contact point of said plurality of contact points of said at least one semiconductor die and a second end terminating adjacent a portion of said periphery of said at least one semiconductor die on said wafer, said at least one conductive trace formed by an extruded viscous conductive material on said at least one semiconductor die active surface between said at least one electric contact point making electrical contact therewith and said portion of said periphery of said at least one semiconductor die.
A wafer manufacturing process for producing a plurality of semiconductor dice comprising:
- forming a plurality of semiconductor dice on a wafer, at least one semiconductor die of said plurality of semiconductor dice on said wafer having a periphery and an active surface with at least one electric contact point;
- and
- forming at least one conductive trace directly on a portion of said active surface of said at least one semiconductor die, said at least one conductive trace comprising a first end electrically contacting at least a portion of said at least one electric contact point of said at least one semiconductor die and a second end terminating adjacent a portion of said at least one semiconductor die periphery on said wafer, said at least one conductive trace including an extruded viscous conductive material on said at least one semiconductor die active surface between said at least one electric contact point making electrical contact therewith and said periphery of said at least one semiconductor die.
A semiconductor die assembly manufacturing method comprising:
- providing a semiconductor die having a periphery and an active surface having at least one electric contact point disposed on said active surface;
- providing a lead frame having at least one lead associated therewith;
- forming at least one conductive trace directly on a portion of said active surface of said semiconductor die, said at least one conductive trace comprising a first end electrically contacting at least a portion of said at least one electric contact point of said semiconductor die and a second end terminating adjacent a portion of said periphery of said semiconductor die, said at least one conductive trace including an extruded viscous conductive material on said semiconductor die active surface between said at least one electric contact point making electrical contact therewith and said portion of said periphery of said semiconductor die;
- and
- attaching a portion of said at least one lead of said lead frame to said at least one conductive trace second end.
2 more elements
A semiconductor die assembly method comprising:
- providing a semiconductor die having a periphery and an active surface having at least one electric contact point disposed on said active surface;
- providing a connector;
- forming at least one conductive trace directly on a portion of said active surface of said semiconductor die, said at least one conductive trace comprising a first end electrically contacting at least a portion of said at least one electric contact point of said semiconductor die and a second end terminating adjacent a portion of said semiconductor die periphery, said at least one conductive trace including an extruded viscous conductive material on said semiconductor die active surface between said at least one electric contact point making electrical contact therewith and said portion of said periphery of said semiconductor die;
- and
- connecting said connector to said at least one conductive trace second end.
2 more elements
A semiconductor die assembly method comprising:
- providing a semiconductor die having a periphery and an active surface having at least one electric contact point;
- providing a lead frame having at least one lead associated therewith;
- forming at least one conductive trace directly on a portion of said active surface of said semiconductor die, said at least one conductive trace comprising a first end electrically contacting at least a portion of said at least one electric contact point of said semiconductor die and a second end terminating adjacent a portion of said periphery of said semiconductor die, said at least one conductive trace including an extruded viscous conductive material on said semiconductor die active surface between said at least one electric contact point making electrical contact therewith and said portion of said periphery of said semiconductor die for forming said at least one conductive trace;
- and
- connecting said at least one lead of said lead frame to said at least one conductive trace second end.
2 more elements
A semiconductor die assembly method comprising:
- providing a semiconductor die having a periphery and an active surface having a plurality of electric contact points;
- providing a lead frame having a plurality of leads associated therewith;
- forming a plurality of conductive traces directly on a portion of said semiconductor die active surface, each conductive trace of said plurality of conductive traces comprising a first end electrically contacting at least a portion of a semiconductor die electric contact point of said plurality of electric contact points and a second end terminating adjacent a portion of said periphery of said semiconductor die, said each conductive trace including an extruded viscous conductive material on said portion of said active surface of said semiconductor die between at least one electric contact point of said plurality of electric contact points making electrical contact therewith and said portion of said periphery of said semiconductor die;
- and
- connecting said plurality of leads of said lead frame to at least a portion of said second end of said plurality of conductive traces.
2 more elements
Dependencies are inferred from the claim text.