Selective solder bump application
AssigneeHewlett-Packard Development Company, L.P.
InventorWayne Kever
Life of this patent
Estimating the term…
Abstract
Selective application of solder bumps in an integrated circuit package. Solder bumps are selectively applied in a solder bump integrated circuit packaging process so that portions of a circuit can be effectively disabled. The bumps may be selectively applied either to a die or to the substrate using multiple solder masks, one for each pattern of solder bumps desired or can be otherwise applied in multiple patterns depending upon which portions of the circuitry are to be active and which are to be disabled.
Claims22
A method of connecting an integrated circuit die to a substrate, comprising:
- identifying a block of circuitry to be disabled within the integrated circuit die, the block of circuitry to be disabled having at least one solder pad that is used to connect to at least one solder pad of said substrate when the block of circuitry is not disabled;
- applying a pattern of solder bumps to one of the die and the substrate, the pattern of solder bumps excluding at least one solder bump used for connection to the at least one solder pad of the block of circuitry to be disabled;
- placing the integrated circuit die on the substrate with solder pads on the die aligned with corresponding solder pads on the substrate and with the pattern of solder bumps disposed between the die and the substrate;
- and
- heating the solder bumps to cause the solder to flow and form electrical connections between the substrate and the die.
A method of applying solder bumps for soldering a substrate to an integrated circuit die, comprising:
- identifying a block of circuitry on the integrated circuit die that is to be disabled, the block of circuitry to be disabled having at least one solder pad that is used to connect to at least one solder pad of said substrate when the block of circuitry is not disabled;
- and
- applying a pattern of solder bumps to one of the die and the substrate, the pattern of solder bumps excluding at least one solder bump used for connection to the at least one solder pad of the block of circuitry to be disabled.
A method of configuring functionality of an integrated circuit die, comprising:
- identifying a block of circuitry to be configured by selectively making an electrical connection between a substrate and the integrated circuit die, the block of circuitry to be configured having at least one solder pad that is used to selectively connect to at least one solder pad of said substrate in order to configure the block of circuitry;
- applying a pattern of solder bumps to one of the die and the substrate, the pattern of solder bumps selectively excluding at least one solder bump used for connection to the at least one solder pad of the block of circuitry;
- placing the integrated circuit die on the substrate with solder pads on the die aligned with solder pads on the substrate and the pattern of solder bumps disposed therebetween;
- and
- heating the solder bumps to cause the solder to flow and form electrical connections between the substrate and the die.
Dependencies are inferred from the claim text.