Lead frame and method for fabricating resin-encapsulated semiconductor device

A method for fabricating a resin-encapsulated semiconductor device, comprising the steps of:

• (a) preparing a lead frame including an upper surface, a bottom surface, a first region provided on the upper surface, and a second region provided on the upper surface and surrounding the first region;
• (b) providing a resin creepage preventing member on an area corresponding to the first region on the bottom surface of the lead frame and another area corresponding to the second region on the bottom surface of the lead frame;
• (c) mounting a semiconductor chip on the first region of the lead frame;
• and
• (d) clamping the second region by an encapsulation mold that includes a die cavity so as to place the semiconductor chip into the die cavity, and filling the die cavity with a resin,
• wherein resin creepage preventing member includes at least one U-shaped groove,
• wherein in the step (b), the at least one U-shaped groove extends from a position corresponding to the first region on the bottom surface of the lead frame across the area corresponding to the second region on the bottom surface of the lead frame, so as to reach a flat surface including a side edge surrounding the second region of the lead frame, and
• wherein in the step (d), the first region of the lead frame is provided within the die cavity, and the side edge of the lead frame is exposed to an ambient air with the die cavity being filled with the encapsulation resin.

A method for fabricating a resin-encapsulated semiconductor device, comprising the steps of:

• (a) preparing a first encapsulation mold including a die cavity and a clamp section and a second encapsulation mold including a surface corresponding to the die cavity and another surface corresponding to the clamp section, the second encapsulation mold including at least one groove extending from an area corresponding to the die cavity across another area corresponding to the clamp section so as to reach still another area surrounding the area corresponding to the clamp section;
• (b) preparing a lead frame including an upper surface, a bottom surface, a first region provided on the upper surface, and a second region provided on the upper surface and surrounding the first region;
• (c) providing a resin creepage preventing member on an area corresponding to the first region on the bottom surface of the lead frame and another area corresponding to the second region on the bottom surface of the lead frame;
• (d) mounting a semiconductor chip on the first region of the lead frame;
• and
• (e) clamping the second region by the first encapsulation mold and the second encapsulation mold so as to place the semiconductor chip into the die cavity, and filling the die cavity with a resin.