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US 6,645,791 B2Granted
Semiconductor die package including carrier with mask
AssigneeFairchild Semiconductor Corporation
InventorsJonathan A. Noquil, Maria Cristina B. Estacio
Life of this patent
Estimating the term…
Abstract
A carrier for use in a semiconductor die package is disclosed. In one embodiment, the carrier includes a die attach region and an edge region. A solder mask is on the edge region.
Claims18
A method for forming a semiconductor die package, the method comprising:
- a) forming a carrier having a die attach region and an edge region, and a solder mask having one or more apertures on the edge region;
- b) attaching a semiconductor die to the die attach region of the carrier;
- and
- c) depositing solder in the one or more apertures in the solder mask wherein a) comprises
- i) depositing a photosensitive layer on the edge region, and
- ii) forming the solder mask from the deposited photosensitive layer.
3 more elements
A method for forming a semiconductor die package, the method comprising:
- a) forming a carrier having a die attach region and an edge region, and a solder mask having one or more apertures on the edge region;
- b) attaching a semiconductor die to the die attach region of the carrier;
- and
- c) depositing solder in the one or more apertures in the solder mask,
- wherein the carrier comprises a base metal and wherein a) comprises
- i) forming one or more layers of material on the base metal,
- ii) depositing a photosensitive layer on the edge region, and
- iii) forming the solder mask from the deposited photosensitive layer.
5 more elements
A method for forming a semiconductor die package, the method comprising:
- a) forming a carrier having a die attach region and an edge region, and a solder mask having one or more apertures on the edge region;
- b) attaching a semiconductor die to the die attach region of the carrier;
- and
- c) depositing solder in the one or more apertures in the solder mask,
- wherein the carrier comprises a base metal and wherein a) comprises
- i) depositing a solder wettable layer on the base metal,
- ii) depositing an oxidation barrier layer on the base metal,
- iii) depositing a photosensitive layer on the edge region, and
- iv) forming the solder mask from the deposited photosensitive layer.
6 more elements
A method for forming a semiconductor die package, the method comprising:
- a) forming a carrier having a die attach region and a plurality of edge regions disposed around and at least partially defining the die attach region, wherein each edge region has a surface that is elevated with respect to the die attach region, and a first solder mask disposed on at least one of the plurality of edge regions;
- b) attaching a semiconductor die comprising a vertical power metal oxide field effect transistor (MOSFET) device having a source region, a drain region, and a gate region to the die attach region, and second solder mask with apertures, wherein the drain region of the semiconductor die is proximate to the die attach region and the source region is distal to the die attach region;
- and
- c) depositing solder in the apertures of the first solder mask and the apertures in the second solder mask substantially simultaneously.
1 more element
Dependencies are inferred from the claim text.