Integrated circuit device having a built-in thermoelectric cooling mechanism
AssigneeBAE Systems Information and Electronic Systems Integration Inc.
InventorsAndrew T. S. Pomerene, Thomas J. McIntyre
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Abstract
A method for manufacturing a thermoelectric cooling mechanism for an integrated circuit is disclosed. Initially, electric circuits are formed on one side of a wafer. Subsequently, thermoelectric cooling devices are formed on an opposite side of the same wafer. Specifically, the thermoelectric cooling devices are formed by depositing a first conductive layer, depositing a layer of Peltier material on top of the first conductive layer, building a set of N30 regions and P30 regions within the Peltier material layer, and depositing a second conductive layer on top of the Peltier material layer.
Claims8
A method for manufacturing a thermoelectric cooling mechanism for an integrated circuit, said method comprising:
- forming a plurality of electric circuits on one side of a wafer;
- and
- forming a plurality of thermoelectric cooling devices on opposite side of said wafer by
- depositing a first conductive layer;
- depositing a layer of Peltier material on top of said first conductive layer;
- building a plurality of N30 regions and P regions within said Peltier material layer;
- and
- depositing a second conductive layer on top of said Peltier material layer.
Dependencies are inferred from the claim text.