Method of producing an optoelectronic component
AssigneeSiemens Aktiengesellschaft
InventorsHerbert Brunner, Hans Hurt
Life of this patent
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Abstract
The optoelectronic component has a radiation-receiving or radiation-emitting semiconductor chip mounted on a base part. The chip is contacted with at least two electrode terminals made of an electrically conductive connection material. The electrode terminals are formed by a thin coating, which is deposited on the outer surfaces of the base part, is applied by electrodeposition and is patterned by means of laser etching.
Claims14
In a method of producing an optoelectronic component, wherein a radiation-receiving or radiation-emitting semiconductor chip is mounted on a base part and is connected to at least two electrode terminals of electrically conductive connection material, and the component is contacted via the electrode terminals, the improvement which comprises:
- covering the base part with a thin coating made of the electrically conductive connection material including copper by deposition from a liquid;
- patterning the thin coating to form individual regions of the coating electrically insulated from one another;
- selectively depositing a further thin layer of auxiliary masking material including tin, on a number of predetermined regions of the thin coating by electrodeposition with external electric current, for increasing a layer thickness of the thin coating at the predetermined regions;
- selectively removing, by etching, regions of the thin coating on the base part that have not been thickened in the depositing step;
- and
- mounting the radiation-receiving or radiation-emitting semiconductor chip on at least one of the base part and the auxiliary masking material and electrically connecting the semiconductor chip to at least one of the electrically conductive connection material and the auxiliary masking material forming the at least two electrode terminals of the component.
A method of producing an optoelectronic component, which comprises:
- providing a base part;
- covering the base part with a thin base part coating of electrically conductive connection material by depositing from a liquid;
- depositing a thin layer of auxiliary masking material including tin, on the thin base part coating and patterning the auxiliary masking material to form a mask with regions of the thin base part coating covered by the auxiliary masking material and regions not covered by the auxiliary masking material;
- selectively etching and removing the thin base part coating in the regions that are not covered by the auxiliary masking material;
- and
- mounting a radiation-receiving or radiation-emitting semiconductor chip on the base part and electrically connecting the semiconductor chip to the electrically conductive connection material forming at least two electrode terminals of the component.
Dependencies are inferred from the claim text.