Photoresist composition
AssigneeShipley Company, L.L.C.
InventorAnthony Zampini
Life of this patent
Estimating the term…
Abstract
Disclosed are new photoresist compositions including polymeric particles as binders and a photoactive component. Also disclosed are methods of forming relief images using these photoresist compositions.
Claims40
A photoresist composition comprising a plurality of cross-linked polymeric particles and a photoactive component, wherein the polymeric particles comprise one or more cleavable groups and wherein the composition is substantially free of surfactant.
A method for forming a photoresist relief image, comprising the steps of applying a coating layer of a photoresist composition comprising a plurality of cross-linked polymeric particles and a photoactive component, wherein the polymeric particles comprise one or more cleavable groups and wherein the photoresist composition is substantially free of a surfactant;
- exposing the photoresist coating layer to patterned activating radiation;
- and developing the exposed photoresist coating layer to provide a photoresist relief image.
A plurality of core-shell polymeric particles comprising one or more photoactive components as core-material, wherein the plurality of core-shell polymeric particles has a mean particle size of about 1 to about 20 nm.
A photoresist composition comprising a plurality of core-shell polymeric particles and a photoactive component, wherein the polymeric particles comprise one or more cleavable groups.
A method for forming a photoresist relief image, comprising the steps of applying a coating layer of a photoresist composition comprising a plurality of core-shell polymeric particles and a photoactive component, wherein the polymeric particles comprise one or more cleavable groups;
- exposing the photoresist coating layer to patterned activating radiation;
- and developing the exposed photoresist coating layer to provide a photoresist relief image.
A photoresist composition comprising a plurality of cross-linked polymeric particles and a photoactive component, wherein the polymeric particles comprise one or more cleavable groups and wherein the composition is substantially free of solvent.
A method for manufacturing an electronic device comprising the steps of disposing on the surface of a substrate a photoresist composition comprising a plurality of cross-linked polymeric particles and a photoactive component, wherein the polymeric particles comprise one or more cleavable groups and wherein the photoresist composition is substantially free of surfactant;
- exposing the photoresist coating layer to patterned activating radiation;
- and developing the exposed photoresist coating layer to provide a photoresist relief image.
A method for manufacturing an electronic device comprising the steps of disposing on the surface of a substrate a photoresist composition comprising a plurality of core-shell polymeric particles and a photoactive component wherein the polymeric particles comprise one or more cleavable groups;
- exposing the photoresist coating layer to patterned activating radiation;
- and developing the exposed photoresist coating layer to provide a photoresist relief image.
A photoresist composition comprising a plurality of cross-linked solution polymer particles and a photoactive component, wherein the polymer particles comprise one or more cleavable groups.
A photoresist composition comprising a plurality of cross-linked polymer particles and a photoactive component, wherein the plurality of cross-linked polymer particles has a mean particle size of about 1 to about 200 nm.
Dependencies are inferred from the claim text.