Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom

A semiconductor device comprising:

• at least one electronic circuit;
• and
• packaging for said at least one electronic circuit comprising a hardened polymeric composition, the polymeric composition comprising at least one epoxy resin, at least one curing agent in an amount of about 30 to 110 parts by weight per 100 parts by weight of the at least one epoxy resin, at least one silica-based reinforcing filler in an amount of about 300 to 2300 parts by weight per 100 parts of the at least one epoxy resin, and at least one control agent for controlling the rheology of the polymeric composition in an amount of about 0.1 to 50 parts by weight per 100 parts by weight of the at least one epoxy resin, the at least one control agent being substantially free from polar groups.

A method for making packaging for a semiconductor device comprising:

• molding a polymeric composition comprising at least one epoxy resin, at least one curing agent in an amount of about 30 to 110 parts by weight per 100 part by weight of the at least one epoxy resin, at least one silica-based reinforcing filler in an amount of about 300 to 2300 parts by weight per 100 parts of the at least one epoxy resin, and at least one control agent for controlling the rheology of the polymeric composition in an amount of about 0.1 to 50 parts by weight per 100 parts by weight of the at least one epoxy resin, the at least one control agent being substantially free from polar groups;
• and
• hardening the polymeric composition to form the packaging.