Film-type adhesive for electronic components, and electronic components bonded therewith

A film-type adhesive for electronic components, consisting essentially of (A) a polyimide resin comprising repeating units of the following structural formula (1) and having a weight-average molecular weight of 5,000 to 150,000 and (B) an epoxy resin having the following structural formula (2), (3) or (4);

• which adhesive has a weight ratio of component (A) to component (B) of 45/55 to 5/95 and a film thickness of 20 to 150 μm,
• wherein X is at least one tetravalent organic group selected from the group consisting of:
• Y is a divalent organic group composed of 30 to 99 mol % of at least one phenolic hydroxyl group-bearing aromatic diamine residue Y1 selected from among
• and 70 to 1 mol % of at least one aromatic diamine residue Y2 selected from among
• Z is a siloxane diamine residue of the following formula:
• wherein R1 is a substituted or unsubstituted monovalent hydrocarbon group of 1 to 10 carbon atoms, the letter “a” is an integer from 1 to 6, and b is an integer from 1 to 120, and
• the letters m and n are positive numbers which satisfy the conditions 0.70≦m/(m+n)≦0.98 and 0.02≦n/(m+n)≦0.30,
• and formulas (2), (3) and (4) are as follows:
• wherein G is a group of the formula:
• Q is a group selected from the group consisting of:
• the letter n is an integer from 0 to 5, and
• R2 is hydrogen or a monovalent hydrocarbon group of 1 to 5 carbon atoms.