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US 6,645,606 B2Granted
Electrical device having metal pad bonded with metal wiring and manufacturing method thereof
AssigneeDenso Corporation
InventorsTetsuo Nakano, Yukihiro Maeda, Yasutomi Asai, Takashi Nagasaka
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Abstract
A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the pads. The thickness of the Au plating layer that is bonded with the Al wiring is less than 0.5 μm. Thickness of the Au plating layer that is bonded with the Au wiring is 0.05 μm or more.
Claims8
An electrical device comprising:
- a substrate having a first surface and a second surface;
- a plurality of pads formed on at least one of the first and second surfaces, wherein each of the plurality of pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer;
- and
- Al wiring bonded with at least one of the plurality of pads, wherein a thickness of an Au plating layer of the at least one of the plurality of pads that is bonded with the Al wiring is less than 0.5 μm.
1 more element
An electrical device comprising:
- a substrate having a first surface and a second surface;
- a plurality of pads formed on at least one of the first and second surfaces;
- Al wiring bonded with at least one of the pads;
- and
- Au wiring bonded with at least one of the pads;
- wherein each of the plurality of pads bonded with the Al wiring and the Au wiring has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer,
- wherein the thickness of an Au plating layer that is bonded with the Al wiring is less than 0.5 μm, and
- wherein a thickness of an Au plating layer that is bonded with the Au wiring is 0.05 μm or more, and
- wherein the thickness of the Au plating layer that is bonded with the Au wiring is thicker than that of the Au plating layer that is bonded with the Al wiring.
6 more elements
Dependencies are inferred from the claim text.