Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing

An apparatus for use in forming a sheet of material for use in semiconductor processing, comprising:

• an annular shim having a border portion and a plurality of projections extending inwardly from the border portion, the projections having a first thickness, a shim open area positioned inwardly of the projections, overflow material recesses being positioned between the projections and communicating with the shim open area;
• and
• first and second pressing surfaces positioned on opposite sides of the shim, the first and second pressing surfaces contacting the shim at least along the projections to compress material on at least one of the first and second pressing surfaces within the shim open area to a substantially uniform thickness equal to the first thickness,
• wherein any material in excess of the volume defined by the shim opening and the first and second pressing surfaces passes outwardly from the shim opening and into the recesses.

In semiconductor processing, an apparatus for forming a layer of a material having a substantially uniform thickness and substantially parallel first and second major surfaces, the material being for use in producing a flat on a semiconductor, the apparatus having:

• a pair of pressing elements each having a flat pressing surface, the pressing surfaces being opposed to one another and operable to compress a quantity of the material therebetween;
• a stop positioned at least partially between the pressing surfaces, the stop having a thickness substantially equal to the desired uniform thickness of the layer and being positioned to establish a spacing between the flat pressing surfaces which is substantially equal to the thickness of the stop and thereby to the desired uniform thickness of the layer when the pressing elements engage the stop;
• and
• whereby engagement of the stop by the pressing surfaces during pressing of the material forms a layer of the material for use in producing a flat on a semiconductor, the layer of material being of substantially uniform thickness with substantially parallel major surfaces formed by the flat pressing surfaces.