Polishing pad having a grooved pattern for use in chemical mechanical polishing
AssigneeApplied Materials, Inc.
InventorsDoyle E. Bennett, Thomas H. Osterheld, Fred C. Redeker, Ginetto Addiego
Life of this patent
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Abstract
A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
Claims28
A polishing pad for polishing a substrate in a chemical mechanical polishing system, comprising:
- a polishing surface having a first polishing region and a second polishing region surrounding the first polishing region, a spiral groove formed in the polishing surface, the spiral groove having a first pitch in the first polishing region and a second, different pitch in the second polishing region.
A polishing pad for polishing a substrate in a chemical mechanical polishing apparatus, comprising:
- a first polishing region having a first plurality of substantially circular concentric grooves;
- and
- a second polishing region surrounding the first polishing region and having a plurality of substantially serpentine grooves.
A polishing pad for polishing a substrate in a chemical mechanical polishing apparatus, comprising:
- a first polishing region having a first plurality of substantially circular concentric grooves;
- and
- a second polishing region surrounding the first polishing region and having a second plurality of substantially circular concentric grooves, a center of the second plurality of concentric grooves being offset from a center of the first plurality of concentric grooves.
A polishing pad for polishing a substrate in a chemical mechanical polishing apparatus, comprising:
- a first polishing region having a first plurality of substantially circular concentric grooves;
- and
- a second polishing region surrounding the first polishing region and having a plurality of groove arc segments, the groove arc segments disposed along concentric circular paths such that each groove arc segment does not radially overlap a groove arc segment on an adjacent path.
A polishing pad for polishing a substrate in a chemical mechanical polishing apparatus, comprising:
- a first polishing region having a first plurality of substantially circular concentric grooves;
- and
- a second polishing region surrounding the first polishing region and having a spiral groove.
Dependencies are inferred from the claim text.