Multimode substrate carrier
AssigneeApplied Materials, Inc.
InventorsPaul D. Butterfield, Phillip R. Sommer
Life of this patent
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Abstract
Generally, a method and apparatus for retaining a substrate is provided. In one embodiment, a carrier for retaining a substrate comprises a carrier plate having a lower surface, at least one first fluid outlet and a second fluid outlet. The first fluid outlet is fluidly coupled to the lower surface of the carrier plate. The second fluid outlet is fluidly coupled to the lower surface of the carrier plate. A first fluid circuit is coupled to the first fluid outlet and is adapted to flow a fluid forms a fluidic layer between the carrier plate and the substrate. A second fluid circuit is coupled to the second fluid outlet and is separate from the first fluid circuit.
Claims19
A method for retaining a substrate comprising the steps of:
- disposing the substrate adjacent a carrier plate;
- flowing a first fluid through a first port disposed on the carrier plate into a plenum at least partially bounded between the substrate and the carrier plate;
- and
- applying at least one of a second fluid or vacuum through a second port disposed on the carrier plate into the plenum between the substrate and the carrier plate.
A method for retaining a substrate comprising the steps of:
- disposing the substrate adjacent a carrier plate;
- flowing a first fluid from a first fluid circuit through a first port disposed adjacent a perimeter of the carrier plate to a space at least partially bounded by the substrate and the carrier plate;
- coupling a second fluid circuit to the space between the substrate and the carrier plate through a second port disposed on the carrier plate inward of the first port;
- and
- coupling a third fluid circuit to the space between the substrate and the carrier plate through a third port
- disposed inward of the second port.
Dependencies are inferred from the claim text.