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US 6,645,044 B2Granted
Method of chemical mechanical polishing with controllable pressure and loading area
AssigneeApplied Materials, Inc.
InventorSteven M. Zuniga
Life of this patent
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Abstract
A method of chemical mechanical polishing uses a carrier head having a flexible membrane that applies a load to a substrate in a loading area with a controllable size. One pressurizable chamber in the carrier head controls the size of the loading area, and another chamber controls the pressure applied to the substrate in the loading area.
Claims17
A method for chemical mechanical polishing a substrate, comprising:
- holding a substrate against a polishing pad with a carrier head;
- applying a load to the substrate in a loading area with a first chamber in the carrier head;
- controlling the size of the loading area with a second chamber in the carrier head;
- and
- creating relative motion between the substrate and the polishing pad.
2 more elements
Dependencies are inferred from the claim text.