High density electrical connector with lead-in device
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsTimothy B. Billman, Iosif R. Korsunsky
Life of this patent
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Abstract
An electrical connector (1) comprises an insulative housing (10) defining a plurality of channels (14), a plurality of circuit boards (30) partially received in the channels, and a spacer (20) assembled with the circuit boards. The spacer includes a plurality of wafers (21) and defines a plurality of tunnels (200) between every two adjacent wafers for partially receiving corresponding circuit boards. Each wafer has a body portion (22), a plurality of terminals (23) for conductively contacting with the circuit board, and a grounding bus (24) covering on the body portion. Each grounding bus forms lead-in portions (245, 248) at opposite sides of an upper end thereof for facilitating insertion of the circuit board and a neighboring circuit board.
Claims1
An electrical connector for being mounted on a mother board, comprising:
- an insulative housing defining a plurality of channels;
- a plurality of circuit boards partially received in the channels;
- and
- a spacer including a plurality of wafers defining a plurality of tunnels between every two adjacent wafers for receiving corresponding circuit boards, each wafer having a body portion, a plurality of terminals retained in the body portion and conductively contacting with signal traces formed on a corresponding circuit board, and a grounding bus covering on the body portion and having a plurality of grounding tabs for conductively contacting with grounding traces formed on the circuit board;
- wherein
- at least one grounding tab of the wafer forms a smooth slope portion at an upper end thereof for facilitating insertion of the circuit board;
- wherein the plurality of wafers are side-by-side arranged;
- wherein the body portion of each wafer defines in one side surface thereof a plurality of passageways for receiving the terminals and a plurality of slots for receiving corresponding grounding tabs of the grounding bus;
- wherein the grounding bus has a body plate covering another side surface of the body portion of each wafer, a flange vertically extending from an upper edge of the body plate and covering a top face of the body portion of each wafer, and a plurality of grounding tails depending from a lower edge of the body plate for insertion into corresponding through holes of the mother board;
- wherein the grounding tabs extend from the flange and are received in corresponding slots of the body portion;
- wherein the smooth slope portion of the grounding tab is adjacent to the flange;
- wherein the grounding bus forms a chamfered portion at a common boundary portion between the flange and the body plate of the grounding bus for facilitating insertion of a corresponding circuit board;
- wherein each terminal and each grounding tab respectively forms a contact point and a protrusion for conductively contacting with a corresponding signal trace and a corresponding grounding trace of the circuit board, respectively;
- wherein a pair of posts extend from opposite ends of the body portion in opposite directions;
- further comprising a fastening device attached to the housing for retaining the spacer and the circuit board to the housing;
- wherein the fastening device has a body wall and a pair of latch arms extending from the body wall;
- wherein each latch arm forms a latch projection, and wherein the housing defines a recessed cavity latching with the latch projection.
Dependencies are inferred from the claim text.