US 6,643,921 B2Granted

Circuit-component mounting method and circuit-component mounting system

AssigneeFuji Machine Mfg. Co., Ltd.

InventorsKoichi Asai, Seigo Kodama, Shinsuke Suhara

Life of this patent

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Abstract

A system for mounting a plurality of circuit components on a circuit substrate, including a substrate supporting device which supports the circuit substrate, a component mounting device which mounts each of the circuit components on the circuit substrate supported by the substrate supporting device, a testing device which tests an actual state in which the each circuit component is mounted on the circuit substrate by the component mounting device, and a control device which controls the component mounting device to mount the each of the circuit components on the circuit substrate and controls the testing device to test, each time one of the circuit components is mounted on the circuit substrate by the component mounting device, an actual state in which the one circuit component is mounted on the circuit substrate.

Claims10

Dependent claims

A method of automatically mounting, with a component mounting device, each one of a plurality of circuit components on a circuit substrate for producing an electric circuit, while automatically inspecting, with an inspecting device, whether said each one circuit component has been appropriately mounted on the circuit substrate, comprising the steps of:

automatically causing the component mounting device to perform a circuit component mounting operation to mount said each one circuit component on the circuit substrate and temporarily fix, with a temporary fixing material, said each one circuit component to the circuit substrate, and
automatically causing the inspecting device to inspect, after said circuit component mounting operation has been performed and before a next circuit component mounting operation is performed, whether said each one circuit component has been appropriately temporarily mounted on the circuit substrate.

Dependencies are inferred from the claim text.

Facts

Application: 09/873,392Filed 5 Jun 2001 · division
Priority: JP 9-216744 Feb 1997
Published: US 2001/0025413 A14 Oct 2001
Granted: 11 Nov 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

H05K 13/0815
Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling…
Y10T 29/49004
Electrical device making: including measuring or testing of device or component part
Y10T 29/4913
On flat or curved insulated base, e.g., printed circuit, etc.: assembling to base an electrical component, e.g., capacitor, etc.
Y10T 29/49131
Assembling to base an electrical component, e.g., capacitor, etc.: by utilizing optical sighting device