US 6,643,920 B2Granted

Electronic component such as a saw device and method for producing the same

AssigneeMurata Manufacturing Co., Ltd.

InventorYoshitsugu Hori

Life of this patent

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Abstract

An electronic component comprises a substrate having a surface on which an electrode is formed and an SAW circuit element having a surface on which a circuit is formed. The circuit element is held such that the surface of the circuit element and the surface of the substrate are opposed to each other. A bump electrode joins the circuit on the circuit element and the electrode of the substrate together, and a sealing material joins the circuit element and the substrate together in the periphery of the space between the circuit-forming surface of the circuit element and the substrate. The space between the circuit-forming surface of the circuit element and the substrate is hermetically sealed by the circuit element, the substrate, and the sealing material. Advantageously, a low-temperature soldering material such as solder, or an adhesive, is used as the sealing material.

Claims5

Dependent claims

A method for producing electronic components comprising the steps of:

disposing a bump electrode in connection with either one of a circuit formed on a circuit element and an electrode disposed on a substrate;
disposing a sealing material having a height smaller than that of said bump electrode on either one of the surface on which said circuit is formed and said substrate so as to surround the circuit formed on the circuit element;
grounding the circuit via the electrode on the substrate by disposing the surface on which the circuit is formed on the circuit element so as to oppose the substrate and to define a space between the circuit element and the substrate, and then placing the circuit in electrical contact with the electrode on the substrate via the bump electrode;
connecting the circuit of the circuit element to the electrode on the substrate through the bump electrode by applying pressure to the bump electrode;
and simultaneously
hermetically sealing the periphery of the space between the circuit element and the substrate with a sealing material.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/170,680Filed 14 Jun 2002 · division
Priority: JP 10-2482582 Sep 1998
Published: US 2003/0000067 A12 Jan 2003
Granted: 11 Nov 2003
Term ends: Not estimatedThe source records don’t support an estimate.

Classification14 codes

H03H 3/08
For the manufacture of electromechanical resonators or networks: for the manufacture of resonators or networks using surface acoustic waves
H03H 9/145
Driving means, e.g. electrodes, coils: for networks using surface acoustic waves
H10W 72/0198
Manufacture or treatment: batch processes
H10W 72/5522
Comprising metals or metalloids, e.g. silver: comprising gold [Au]