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AssigneeSiliconware Precision Industries Co., Ltd.
InventorChien-Ping Huang
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A semiconductor device package fabrication method is proposed, which is used for the fabrication of a semiconductor device package of the type having a core-hollowed portion that is typically used to house an optically-sensitive semiconductor device such as an image sensor or an ultraviolet-sensitive EPROM (Electrically-Programmable Read-Only Memory) device. The proposed method is characterized in the use of a support pillar, which is positioned beneath the lead frame when the lead frame is clamped between a top inserted mold and a bottom cavity mold, to help prevent resin flash on the lead frame during the molding of the core-hollowed portion. As a result, the proposed method can help strengthen the bonding of the semiconductor device on the die pad as well as the wire bonding on the inner end of the finger portion of the lead frame, Moreover, since the making of the support pillar would be significantly cheaper and easier to implement than the use of an organic high-molecule coating and a solvent as in the case of the prior art flash prevention, the proposed method is more cost-effective and environmentally-friendly to use than the prior art.
A method of fabricating a semiconductor device package, comprising the steps or
Dependencies are inferred from the claim text.