Methods for shielding of cables and connectors
AssigneeShielding for Electronics, Inc.
InventorsJesus Al Ortiz, Rocky R. Arnold
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Abstract
The present invention provides methods for shielding a cable that comprises a plurality of conductive leads that are encapsulated by a dielectric substrate. One embodiment of the method comprises applying a metallized layer around the dielectric substrate and coupling a metallized thermoform shield around an end of the metallized dielectric substrate and conductive leads so as to create a conductive connection between the metallized thermoform shield and the metallized layer on the dielectric substrate.
Claims9
A method of shielding a cable, the cable comprising a plurality of conductive leads encapsulated within a dielectric substrate and a connector on at least one end of the cable, the method comprising:
- applying a metallized layer around the dielectric substrate which encapsulates the conductive leads;
- and
- coupling a metallized thermoform shield around the connector and with the metallized layer so as to improve a conductive connection between the metallized thermoform shield and the metallized layer around the dielectric substrate,
- wherein the metallized thermoform shield comprises bumps to improve contact between metallized layer and the thermoform shield.
Dependencies are inferred from the claim text.