Method to assemble a capacitor plate for substrate components
AssigneeHewlett-Packard Development Company, L.P.
InventorThane M. Larson
Life of this patent
Estimating the term…
Abstract
A method and apparatus to mount a capacitor plate to a substrate, under a component. One embodiment of the invention involves a method to assemble a capacitor plate on a substrate. A second embodiment of the invention involves a method to fabricate a capacitor plate. A third embodiment of the invention involves an assembled substrate with a capacitor plate on the second side of the assembled substrate, under an electrical contact area of a component on the first side of the assembled substrate.
Claims19
A method to assemble a capacitor plate to one side of a substrate having a first side and a second side, and a first electrical contact area on said first side, and a second electrical contact area on said second side, the method comprising:
- connecting a component to said first electrical contact area on said first side of said substrate;
- performing In-Circuit Testing of the substrate with the connected component, said second electrical contact area is used for the In-Circuit Testing;
- and
- connecting said capacitor plate to said second electrical contact area on said second side, opposite said first electrical contact area on said first side of said substrate, wherein said capacitor plate is connected to said second electrical contact area after completing the In-Circuit Testing.
A method for assembling a substrate assembly, the method comprising:
- connecting a component to a first electrical contact area on a first side of a substrate;
- performing In-Circuit Testing of the substrate with the connected component, wherein the In-Circuit Testing is performed on a second electrical contact area on a second side of the substrate;
- and
- connecting a capacitor plate to the second electrical contact area on the second side, opposite the first electrical contact area on the first side of the substrate, wherein the capacitor plate is connected to the second electrical contact area after completing the In-Circuit Testing.
Dependencies are inferred from the claim text.