Method of making a proximity probe

A method of making a proximity probe, the steps including:

• providing a preform having an interior cavity accessible by an opened rearward end;
• coupling a coil to the preform proximate a forward most end of the preform for defining a coil and preform assembly;
• locating a single support pin through the rearward end such that the single support pin extends within the interior cavity of the preform while having an end emanating from the opened rearward end of the perform;
• cantilevering the end of the single support pin emanating from the opened rearward end of the preform between an upper and a lower mold plate defining a mold cavity for supporting the coil and preform assembly from the rear ward end with only the single support pin received within the interior cavity of the preform assembly and cantilevered between the upper and the lower mold plate defining the mold cavity;
• injecting moldable material into the mold cavity for molding an encapsulation of material over the coil and preform assembly wherein the encapsulated coil and preform assembly defines an encapsulated probe tip,
• allowing the encapsulated probe tip to cure;
• removing the encapsulated probe tip from the mold cavity;
• removing the support pin from the coil and preform assembly, and
• coupling a cable to the encapsulated probe tip after the injecting step for forming a proximity probe.

A method of making a proximity probe, the steps including:

• providing a preform having an interior cavity accessible by an opened rearward end;
• coupling a coil to the preform proximate a forward most end of the preform for defining a coil and preform assembly;
• locating a single support pin through the rearward end such that the single support pin extends within the interior cavity of the preform while having an end emanating from the opened rearward end of the perform;
• cantilevering the end of the single support pin emanating from the opened rearward end of the preform between an upper and a lower mold plate defining a mold cavity for supporting the coil and preform assembly from the rear ward end with only the single support pin received within the interior cavity of the preform assembly and cantilevered between the upper and the lower mold plate defining the mold cavity;
• injecting moldable material into the mold cavity for molding an encapsulation of material over the coil and preform assembly wherein the encapsulated coil and preform assembly defines an encapsulated probe tip;
• forming a through bore with the encapsulation at a location proximate the opened back end of the encapsulation for providing open communication between an exterior of the encapsulation and the interior cavity;
• allowing the encapsulated probe tip to cure;
• removing the encapsulated probe tip from the mold cavity;
• removing the support pin from the coil and preform assembly, and
• coupling a cable to the encapsulated probe tip after the injecting step for forming a proximity probe.