Method and apparatus for adhesion testing of thin film materials
OwnerPhuc Van, Yuen Liminventors
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Abstract
An apparatus for the automatic testing the adhesion characteristics of thin film and coating to silicon wafers, and the processing of the data obtained thereby to present to the user a rapid and accurate forecast of the thin film's behavior in a selected processing environment. The apparatus of the invention heats and cools samples while automatically monitoring for debonding. Information collected from the optical and thermal devices are processed by computer for analysis and recorded for cataloging. Information is collected and processed over time while samples are subjected to selected temperature environments to provide a data base of adhesion characteristics of thin films and coatings.
Claims5
A computer program embodied on a computer executable form for analyzing adhesion characteristics of thin film materials, the computer program comprising:
- a code segment that collects at least two image data sets of a sample material utilizing an image capturing device;
- a code segment that collects temperature data from a temperature sensing device;
- a code segment that collects time data from a timing device;
- a code segment that compares the at least two image data sets, wherein a resulting set of image data is generated;
- and
- a code segment that extracts features from the resulting set of image data, wherein the temperature data and time data are recorded when features extracted from the resulting image indicate a change has occurred in the sample material.
Dependencies are inferred from the claim text.