Holding and heat dissipation structure for heat generation part
AssigneeYazaki Corporation
InventorsHiroyuki Ashiya, Yoshiyuki Tanaka, Yayoi Maki
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AssigneeYazaki Corporation
InventorsHiroyuki Ashiya, Yoshiyuki Tanaka, Yayoi Maki
Estimating the term…
In a holding and heat dissipation structure for a heat generation part for dissipating heat generated from the heat generation part having lead portions protruded from the main body thereof are soldered at a main substrate, a terminal plate is disposed at a position opposing to the main substrate with a predetermined distance therebetween, and a part housing portion for holding the part is provided at the terminal plate. The part housing portion is concavely formed. Insertion holes for inserting the lead portions protruded from the main body are formed at the part housing portion and the main substrate, respectively. The lead portions are inserted into these insertion holes, and the lead portions and the land portions of the main substrate are fixed to each other by the soldering in a state that the main body is separated from the bottom surface of the part housing portion.
A holding and heat dissipation structure for a heat generation part soldered at a substrate and having lead portions protruded from a main body thereof, the holding and heat dissipation structure comprising:
Dependencies are inferred from the claim text.