Method of shunting and deshunting a magnetic read element during assembly

A method for substantially protecting an electronic component from EDS/EOS, said component including a pair of spaced apart leads for conducting current;

• the method comprising the step of:
• applying a conductive element between the pair of spaced apart leads wherein the conductive element, the conductive element including solder and providing a shunt between the pair of spaced apart leads;
• forming a channel underneath the conductive element;
• melting at least a portion of the solder to remove the shunt;
• and
• collecting the melted solder in the channel.

An intermediate article of manufacture of a magnetoresistive head with a protective device comprising:

• a sensor element having terminal pads;
• shunting means connected across the sensor element for shunting the sensor element to discharge static electrical charge during the manufacture of the magnetoresistive head;
• and
• a channel located underneath the sensor element wherein when heat is applied to the shunting means at least a portion of the shunting means flows into the channel to remove the shunt.

A magnetoresistive head with a protective device for discharging electrical charge during manufacture of the magnetoresistive head, comprising:

• a sensor element having sensor terminals;
• a shunt element having first and second shunt terminals connected to the sensor terminal, and further including solder connecting the first and second terminals together for shunting the sensor element;
• and
• a channel positioned adjacent the solder, wherein the channel is configured to collect at least a portion of the solder when the solder is heated to disconnect the first and second terminals and remove shunting of the sensor element.