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US 6,643,048 B2Granted
Low-loss electrode structures using resistive connections for optical modulation applications
AssigneeCodeon Corporation
InventorsGanesh K. Gopalakrishnan, Kevin G. Donovan, Richard C. Blanchard
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Abstract
An optical device includes a grounded base and an optical modulator chip having a top surface, a back surface and side surfaces. The optical modulator chip is positioned on the grounded base with the back surface facing the grounded base. The optical modulator chip includes a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip. The first and second ground electrodes of the optical modulator chip are interconnected with resistive layers on a surface of the optical modulator chip.
Claims35
An optical device comprising:
- a grounded base;
- an optical modulator chip having a top surface, a back surface and side surfaces, wherein the optical modulator chip is positioned on the grounded base with the back surface of the optical modulator chip facing the grounded base;
- and
- a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip, wherein the first and second ground electrodes are connected to first and second extended resistive electrodes that extend down at least one side of the optical modulator chip and are connected to the grounded base.
1 more element
An optical device comprising:
- a grounded base;
- a transition chip for interconnecting an optical modulator chip having a top surface, a back surface and side surfaces, wherein the transition chip is positioned on the grounded base with the back surface of the transition chip facing the grounded base;
- and
- a first ground connection lead, a signal connection lead and a second ground connection lead located over the top surface of the transition chip, wherein the first and second ground connection leads are interconnected to first and second extended resistive connection leads that extend down at least one side of the transition chip and are connected to the grounded base.
1 more element
An optical device comprising:
- a grounded base;
- an optical modulator chip positioned on the grounded base having a top surface, a back surface and side surfaces;
- a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip;
- a transition chip for interconnecting the optical modulator chip to external connections having a top surface, a back surface and side surfaces, wherein the transition chip is positioned on the grounded base with the back surface of the transition chip facing the grounded base;
- and
- a first ground connection lead, a signal connection lead and a second ground connection lead located on the top surface of the transition chip, wherein the first and second ground connection leads are connected to first and second extended resistive connection leads that extend down at least one side of the transition chip and are connected to the grounded base.
3 more elements
An optical device comprising:
- a grounded base;
- an optical modulator chip having a top surface, a back surface and side surfaces, wherein the optical modulator chip is positioned on the grounded base with the back surface of the optical modulator chip facing the grounded base;
- at least one ground electrode and a signal electrode located over the top surface of the optical modulator chip, wherein the at least one ground electrode is connected to an extended resistive electrode that extends down one side of the optical modulator chip and is connected to the grounded base;
- a transition chip for interconnecting the optical modulator chip having a top surface, a back surface and side surfaces, wherein the transition chip is positioned on the grounded base with the back surface of the transition chip facing the grounded base;
- and
- at least one connection lead located on the top surface of the transition chip.
3 more elements
An optical device comprising:
- a grounded base;
- an optical modulator chip having a top surface, a back surface and side surfaces, wherein the optical modulator chip is positioned on the grounded base with the back surface of the optical modulator chip facing the grounded base;
- at least one ground electrode and a signal electrode located over the top surface of the optical modulator chip;
- a transition chip for interconnecting the optical modulator chip having a top surface, a back surface and side surfaces, wherein the transition chip is positioned on the grounded base with the back surface of the transition chip facing the grounded base;
- and
- at least one connection lead located on the top surface of the transition chip, wherein a resistive via through the transition chip interconnects the at least one ground connection lead with the grounded base.
3 more elements
An optical device comprising:
- a grounded base on which an optical modulator chip is positioned;
- a first ground electrode, a signal electrode and a second ground electrode located on the optical modulator chip;
- and
- wherein the first and second ground electrodes are connected to each other and the grounded base with resistive electrodes on a side of the optical modulator chip.
1 more element
An optical device comprising:
- a grounded base on which an optical modulator chip is positioned;
- a first ground electrode, a signal electrode and a second ground electrode located on the optical modulator chip;
- a transition chip having a first connection lead connected to the first ground electrode, a signal connection lead connected to the signal electrode and a second connection lead connected to the second ground electrode;
- and
- wherein the first and second connection leads are connected to each other and the grounded base with resistive connection leads on a side of the transition chip.
2 more elements
Dependencies are inferred from the claim text.