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AssigneeInspex, Inc.
InventorsChin-Jung Hsu, Arnold Cheng, Xin Song
Estimating the term…
A data management system for reviewing at least one layer of at least one semiconductor wafer is connected to a first inspection device and a second inspection device. The system includes a server which is connected to the first and second inspection devices. A review station is connected to the server. In use, the first inspection device scans at least one layer of at least one semiconductor wafer so as to yield a first set of detected defects. In addition, the second inspection device scans at least one layer of at least one semiconductor wafer so as to yield a second set of detected defects. The first and second sets of detected defects are uploaded into a database in the server. The review station is then used to extract a sample of the first and second sets of detected defects from the database using at least one defect sampling condition.
A system for reviewing at least one layer of at least one semiconductor wafer for defects, said system being interfaced to a first inspection device which scans the at least one layer of the at least one semiconductor wafer for defects, said first inspection device producing a first set of detected defects from scanning the at least one layer of the at least one semiconductor wafer, said system being interfaced to a review station for reviewing the at least one layer of the at least one semiconductor wafer, said system comprising:
A method for reviewing at least one layer of at least one semiconductor wafer for defects using at least one inspection mechanism, said at least one inspection mechanism being connected to a server which includes a database, said server being connected to a review station, said method comprising the steps of:
The method as claimed in 14 further comprising a set-up step for creating the at least one defect sampling condition.
A system for reviewing a layer of a semiconductor wafer for defects, said system being interfaced to a first inspection device which scans the layer of the semiconductor wafer for defects, said first inspection device producing a first set of detected defects from scanning the layer of the semiconductor wafer, said system being interfaced to a review station for reviewing the layer of the semiconductor wafer, said system comprising:
A method for reviewing first and second layers of a semiconductor wafer for defects using at least one inspection mechanism, said at least one inspection mechanism being connected to a server which includes a database, said server being connected to a review station, said method comprising the steps of:
Dependencies are inferred from the claim text.