Advanced electronic microminiature coil and method of manufacturing

A microelectronic component package comprising:

• an insulating base having at least one recess formed therein;
• at least one substantially toroidal magnetically permeable core having at least one gap formed therein;
• a first winding wound at least in part around said at least one core, said first winding having a first and second end;
• at least one layer of insulation material coating at least a portion of said first winding;
• a second winding wound at least in part around said at least one core and atop at least a portion of said at least one layer of insulation material, said second winding having a first and second end;
• and
• a terminal array comprising a plurality of electrically conductive terminals, said terminal array in fixed relationship with said insulating base;
• wherein said at least one core is disposed at least partly within a corresponding one of said at least one recess, and said first and second ends of said first and second windings are in electrical communication with respective ones of said terminals.

A microelectronic toroidal circuit element comprising:

• a unitary toroidal core, at least a portion of said core comprising a magnetically permeable material;
• a first conductive winding having a plurality of turns, at least a portion of said first winding being disposed around said core;
• at least one substantially uniform layer of insulating material adherently coating at least a portion of said first winding;
• and
• a second conductive winding having a plurality of turns, at least a portion of said second winding being disposed around said core and atop said at least one layer of insulating material;
• wherein said adherent coating by said at least one substantially uniform layer permits said circuit element to be smaller in size than would otherwise be achievable using a tape layer.

A toroidal circuit element being optimized for space conservation, comprising:

• a unitary toroidal core, at least a portion of said core comprising a magnetically permeable material;
• a first conductive winding having a plurality of turns and comprising a fine-gauge wire having a film coating of insulation, said first conductive winding being disposed around said core in a high spatial density;
• at least one layer of insulating material coating at least a portion of said first winding, wherein said at least one layer of insulating material has a substantially uniform thickness;
• and
• a second conductive winding having a plurality of turns, at least a portion of said second winding being disposed around said core and atop said at least one layer of insulating material;
• wherein said fine gauge wire, film coating, and at least one layer of insulating material cooperate to minimize the volume consumed by said circuit element.

A high-withstand voltage microelectronic toroidal circuit element, comprising:

• a unitary toroidal core, at least a portion of said core comprising a magnetically permeable material;
• a first conductive winding having a plurality of turns, at least a portion of said primary winding having at least a thin film layer of dielectric material, at least a portion of said first winding being disposed around said core;
• at least one unitized layer of insulating material coating at least a portion of said first winding, wherein said at least one layer of insulating material has a substantially uniform and controlled thickness;
• and
• a second conductive winding having a plurality of turns, at least a portion of said second winding having a thin film layer of dielectric material and being disposed around said core and atop said at least one layer of insulating material;
• wherein at least said thin film layers and said at least one layer of insulating material cooperate to provide said circuit element with both a high dielectric strength and high spatial density.

A high-withstand voltage, space optimized toroidal circuit element, comprising:

• a unitary toroidal core, at least a portion of said core comprising a magnetically permeable material, said core having at last one gap formed therein and an outer surface;
• a first unitized layer of insulating material deposited on said outer surface having a substantially uniform thickness;
• a first conductive winding having a plurality of turns and at least a thin film layer of dielectric material, at least a portion of said first winding being disposed around said core in high spatial density wherein at least two rows of said turns are formed, a second of said two rows being disposed atop a first of said two rows;
• a second unitized layer of insulating material coating at least a portion of said first winding, wherein said second layer of insulating material has a substantially uniform thickness;
• and
• a second conductive winding having a plurality of turns, at least a portion of said second winding having a thin film layer and being disposed around said core and atop said at least one layer of insulating material;
• wherein at least said thin film layers and said first layer of insulating material cooperate to provide said circuit element with both a high dielectric strength and high spatial density.