Semiconductor package for chip with testing contact pad connected to outside
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsLien-Chen Chiang, Ya-Yi Lai
Life of this patent
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Abstract
A semiconductor package for chip with testing contact pad includes a chip, a plurality of leads, at least a flow-conducting plate, and a molding compound. The chip has an active surface provided with a plurality of functional contact pads and at least a testing contact pad. The leads are bonded onto the active surface of the chip and respectively connected to the functional contact pads through a plurality of functional wires. The flow-conducting plate is connected to the testing contact pad through at least a testing wire. The molding compound encapsulates the chip, the leads, the flow-conducting plate, the functional contact pads, and the testing contact pads.
Claims16
A semiconductor package comprising:
- a chip having an active surface provided with a plurality of functional contact pads and at least a testing contact pad thereon;
- a plurality of leads respectively bonded onto the active surface of the chip and respectively connected to the functional contact pads through a plurality of functional wires;
- at least a flow-conducting plate connected to the testing contact pad through at least a testing wire;
- and
- a molding compound encapsulating the chip, the leads, the flow-conducting plate, the functional wires and the testing wires.
A semiconductor package comprising:
- a chip having an active surface and a corresponding back surface, the active surface having a plurality of functional-contact pads and at least a testing contact pad thereon;
- a die pad bonded to the back surface of the chip;
- a plurality of leads respectively connected to the functional contact pads through a plurality of functional wires;
- at least a flow-conducting plate connected to the testing contact pad through at least a testing wire;
- and
- a molding compound encapsulating the chip, the die pad, the leads, the flow-conducting plate, the functional wires and the testing wires.
Dependencies are inferred from the claim text.