Test carrier with molded interconnect for testing semiconductor components

A test carrier for testing a semiconductor component having a plurality of component contacts comprising:

• a plastic board comprising an electrical connector;
• an interconnect molded to the plastic board comprising a surface and a plurality of interconnect contacts on the surface in electrical communication with the electrical connector configured to make temporary electrical connections with the component contacts, the interconnect at least partially encapsulated in the plastic board with the surface and the interconnect contacts unencapsulated;
• and
• a clip member configured to hold the component on the interconnect.

A test carrier for testing a semiconductor component having bumped contacts comprising:

• a board comprising an electrical connector;
• an interconnect on the board comprising a substrate and a plurality of interconnect contacts on the substrate in electrical communication with the electrical connector, the interconnect contacts comprising recesses at least partially covered with conductive layers in electrical communication with the electrical connector and configured to make temporary electrical connections with the bumped contacts,
• the interconnect at least partially encapsulated in the board with the interconnect contacts unencapsulated;
• and
• a plurality of clip members on the board configured to retain the component on the interconnect.