Multi-layered copper bond pad for an integrated circuit
AssigneeMicron Technology, Inc.
InventorAllen McTeer
Life of this patent
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Abstract
A multi layered copper bond pad for a semiconductor die which inhibits formation of copper oxide is disclosed. A small dose of titanium is implanted in the copper surface. The implanted titanium layer suppresses the copper oxide growth in the copper bond pad by controlling the concentration of vacancies available to the copper ion transport. An interconnect structure such as a wire bond or a solder ball may be attached to the copper-boron layer to connect the semiconductor die to a lead frame or circuit support structure. In another embodiment, a titanium-aluminum passivation layer for copper surfaces is also disclosed. The titanium-aluminum layer is annealed to form a titanium-aluminum-copper alloy. The anneal may be done in a nitrogen environment to form a titanium-aluminum-copper-nitrogen alloy.
Claims14
A copper bond pad for a semiconductor device, said bond pad comprising:
- a dielectric layer formed over a substrate of said semiconductor device;
- a barrier layer formed over said dielectric layer;
- a copper layer formed over said barrier layer, said copper layer having an upper surface implanted with titanium;
- a passivation layer formed over said copper layer, wherein said passivation layer is formed of a material selected from the group consisting of silicon oxide, oxynitride, silicon nitride, borophosphosilicate glass and polyimide;
- an insulating layer over said passivation layer;
- and
- a via formed in said insulating layer and said passivation layer, said via exposing a portion of said copper layer and defining said bonding pad area.
A copper bond pad for a semiconductor device, said bond pad comprising:
- a dielectric layer formed over a substrate of said semiconductor device;
- a barrier layer formed over said dielectric layer;
- a copper layer formed over said barrier layer, said copper layer having a titanium-aluminum layer formed over at least an upper surface portion of said copper layer;
- and
- an insulating layer over said copper layer having a via defining said bond pad.
Dependencies are inferred from the claim text.