System and method for adhesion improvement at an interface between fluorine doped silicon oxide and tantalum
AssigneeAdvanced Micro Devices, Inc.
InventorsMinh Van Ngo, Dawn Hopper, Jeremy Martin
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AssigneeAdvanced Micro Devices, Inc.
InventorsMinh Van Ngo, Dawn Hopper, Jeremy Martin
Estimating the term…
A Fluorine doped Silicon Oxide (SiO2)/Tantalum interface and method for manufacturing the same are provided that ensure the structural integrity of integrated circuits that include a Fluorine doped Silicon Oxide structure and a corresponding Tantalum barrier layer. The Fluorine doped Silicon Oxide (SiO2)/Tantalum interface comprises an amount of Silicon Nitride (SiN) in a surface region of a Fluorine doped Silicon Oxide structure. The concentration of Fluorine in the surface region is depleted with respect to a concentration of Fluorine in the remaining portion(s) of the Fluorine doped Silicon Oxide structure. The Fluorine doped Silicon Oxide (SiO2)/Tantalum interface also includes an amount of Tantalum Nitride (TaN) in the surface region. Finally, a Tantalum barrier layer is deposited over the surface region.
A Fluorine doped Silicon Oxide (SiO2)/Tantalum interface, comprising:
An interface region of a Fluorine doped Silicon-Oxide structure, comprising:
An interface region of a Fluorine doped Silicon-Oxide structure, comprising:
Dependencies are inferred from the claim text.