Techniques for joining an opto-electronic module to a semiconductor package

A method for attaching an optical device package to a semiconductor device package comprising:

• forming a wirebond stud on an electrical contact surface located on a top surface of the semiconductor device package;
• applying an adhesive material to the wirebond stud;
• placing the optical device package on top of the semiconductor device package such that an electrical contact surface on the optical device package makes contact with the wirebond stud and the adhesive material applied to the wirebond stud,
• wherein the electrical contact surface on the optical device package is part of a flexible tape material having embedded circuit traces, the embedded circuit traces having a first end connected to an optical device component and a second end that forms the electrical contact surface of the optical device package;
• and
• curing the adhesive material whereby the optical device package is firmly attached to the semiconductor device package.

A method for attaching an optical device package to a semiconductor device package comprising:

• forming a wirebond stud on an electrical contact surface located on a top surface of the semiconductor device package;
• applying an anisotropic conductive film to a bottom surface of the optical device package, the anisotropic conductive film containing conductive particles, the bottom surface of the optical device package containing electrical contact surfaces;
• placing the bottom surface of the optical device package onto the top surface of the semiconductor device package such that the electrical contact surfaces of the optical device package are aligned with the wirebond studs;
• and
• applying pressure and heat to the optical and the semiconductor device packages such that the wirebond stud sinks into the anisotropic conductive film and compresses the conductive particles together, the compressed conductive particles forming an electrically conductive pathway between the wirebond stud and the electrical contact surface on the optical device package.

A method for attaching an optical device package to a semiconductor device package comprising:

• forming a wirebond stud on an electrical contact surface located on a top surface of the semiconductor device package;
• applying an anisotropic conductive film to a bottom surface of the optical device package, the anisotropic conductive film containing conductive particles, the bottom surface of the optical device package containing electrical contact surfaces,
• wherein the electrical contact surface on the optical device package is part of a flexible tape material having embedded circuit traces, the embedded circuit traces having a first end connected to an optical device component and a second end that forms the electrical contact surface of the optical device package;
• placing the bottom surface of the optical device package onto the top surface of the semiconductor device package such that the electrical contact surfaces of the optical device package are aligned with the wirebond studs;
• and
• applying pressure and heat to the optical and the semiconductor device packages such that the wirebond stud sinks into the anisotropic conductive film and compresses the conductive particles together, the compressed conductive particles forming an electrically conductive pathway between the wirebond stud and the electrical contact surface on the optical device package.