Wire bonding method and semiconductor package manufactured using the same

A semiconductor package comprising:

• substrate comprising a resin layer, with a chip mounting region, a plurality of electrically conductive circuit patterns, and one or more electrically conductive transfer patterns overlying the resin layer, said one or more transfer patterns located between the chip mounting region and at least some of the circuit patterns;
• a first semiconductor chip within the chip mounting region and electrically coupled to some of the circuit patterns;
• and
• a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the first semiconductor chip through at least a pair of wires and at least one said transfer pattern, with each wire having an end coupled to the transfer pattern.

A semiconductor package comprising:

• a substrate comprising a resin layer, with a chip mounting region, a plurality of electrically conductive circuit patterns, and one or more electrically conductive transfer patterns overlying the resin layer;
• a first semiconductor chip and a second semiconductor chip coupled to the substrate within the chip mounting region,
• wherein the first and second semiconductor chips are laterally adjacent to each other, are each electrically coupled to the circuit patterns through respective electrically conductive wires, and
• wherein the first and a second semiconductor chips are electrically coupled to each other through at least one said transfer pattern located laterally between the first and second semiconductor chips.