MOS transistor with vertical columnar structure

A semiconductor device comprising:

• a columnar structure portion including a buried insulation film and a first semiconductor layer which are stacked over a semiconductor substrate, said buried insulation film having contact surfaces, said buried insulation film being disposed between the semiconductor substrate and the first semiconductor layer, the contact surfaces being covered completely with said semiconductor substrate and said first semiconductor layer;
• a second semiconductor layer disposed between the semiconductor substrate and the first semiconductor layer, and disposed on said buried insulation film in a region between said semiconductor substrate and first semiconductor layer;
• and
• a gate electrode formed over a surface of said second semiconductor layer with a gate insulation film being interposed therebetween.

A semiconductor device comprising:

• a first element formation layer including a plurality of field-effect transistors of horizontal structure formed over a semiconductor substrate;
• a second element formation layer including a plurality of field-effect transistors of horizontal structure, the second element formation layer formed on a plane different from said first element formation layer;
• and
• a field-effect transistor of vertical columnar structure provided between said first element formation layer and said second element formation layer and connected to at least one transistor of said first element formation layer and to at least one transistor of said second element formation layer,
• said field-effect transistor of vertical columnar structure including a semiconductor layer formed on said semiconductor substrate in a columnar state, a gate electrode formed over a side surface of said semiconductor layer, and a buried insulation film for making an effective depth of a channel shallow, said buried insulation film being formed inside a region in which said channel is formed.

A semiconductor device comprising:

• a columnar structure portion including a first semiconductor layer, a buried insulation film and a second semiconductor layer in a stacked arrangement, the buried insulation film being disposed between the first and second semiconductor layers and having dimensions in a plane perpendicular to the direction of the stacking smaller than the dimensions of the first and second semiconductor layers to form a recess between the first and the second semiconductor layers and the edge of the buried insulation film
• a third semiconductor layer disposed in at least the recess at a side surface of said columnar structure portion;
• a gate insulation film disposed on the third semiconductor layer;
• and
• a gate electrode disposed over a surface of said gate insulation film.

A semiconductor device comprising:

• a columnar structure portion which includes:
• a first semiconductor layer;
• an insulating layer formed on the first semiconductor layer;
• a second semiconductor layer formed on the insulating layer;
• a third semiconductor layer surrounding a side surface of the first and second semiconductor layers and the insulating layer;
• and
• a gate electrode formed over a side surface of the third semiconductor layer with a gate insulating layer interposed therebetween.

A semiconductor device comprising:

• a field-effect transistor having a vertical columnar structure, said field-effect transistor includes a semiconductor substrate, a semiconductor layer formed over part of said semiconductor substrate and a gate electrode formed over a side surface of said semiconductor layer with a gate insulation film interposed therebetween, said gate electrode introducing a channel in said semiconductor layer;
• and
• an insulation film formed in at least part of a region in said field effect transistor
• wherein said semiconductor layer of said field effect transistor comprises a first semiconductor layer and a second semiconductor layer, said first semiconductor layer disposed over part of the semiconductor substrate, said insulation film disposed on a portion of said first semiconductor layer, and said second semiconductor layer disposed on the insulation film and being dimensioned larger than the insulation film to form a set back region between the first and second semiconductor layers and adjacent a portion of a side surface of the insulation film, and said gate insulation film disposed on a portion of a side surface of the first and second semiconductor layers and the set back region.