Silicon sub-mount capable of single wire bonding and of providing ESD protection for light emitting diode devices
AssigneeCalifornia Micro Devices Corporation
InventorsAdam John Whitworth, Faraj A. Sherrima, Ashok Kumar Chalaka
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Abstract
An apparatus consisting of a single wire bond silicon sub-mount used to make an LED device which also has built-in ESD protection in the sub-mount. The single wire bond silicon sub-mount uses a pass-through interconnection between the topside of the sub-mount and the underside so that the LED chip mounted thereon is electrically coupled through the sub-mount to the anode.
Claims15
A system for enabling illumination, said system connecting to a lead frame having an anode and cathode, said system comprising:
- a light emitting diode device having a first and second terminal;
- and
- a semiconductor based sub-mount for mounting said LED device thereon, said sub-mount having a topside and an underside, said sub-mount including a pass-through interconnect electrically coupling said topside with said underside through said sub-mount, said pass-through interconnect further electrically coupling said second terminal of said light emitting diode device with said cathode when said second terminal is connected to said topside, said pass-through interconnect formed by contiguous n regions, further wherein said first terminal of the light emitting diode device is connectable to said anode via a single wire bond, said wire bond connected to said topside, said sub-mount further including an electro-static discharge protection circuitry extending from said topside, said protection circuitry coupled to said topside in the region where said first terminal is connectable.
A semiconductor sub-mount apparatus for mounting a light emitting diode device to a lead frame, said device having a first and second terminal, said lead frame consisting of an anode and a cathode, said sub-mount apparatus mountable entirely upon said cathode, comprising:
- a topside upon which said first and second terminals of said light emitting diode device are connectable, said first terminal of the light emitting diode device connectable to said anode via a single wire bond, said wire bond connected to said topside;
- an underside having an exposed surface of conductive material, said underside disposed upon and coupling to said cathode;
- electro-static discharge protection circuitry extending from said topside, said protection circuitry coupled to said topside in the region where said first terminal is connectable;
- and
- a pass-through interconnect electrically coupling said topside with said underside through said sub-mount, said pass-through interconnect further electrically coupling said second terminal of said light emitting diode device with said cathode when said second terminal is connected to said topside, wherein said pass-through interconnect is formed by contiguous n regions.
A semiconductor sub-mount apparatus for mounting a light emitting diode device to a lead frame, said device having a first and second terminal, said lead frame consisting of an anode and a cathode, said sub-mount apparatus mountable entirely upon said cathode, comprising:
- a topside upon which said first and second terminals of said light emitting diode device are connectable, said first terminal of the light emitting diode device connectable to said anode via a single wire bond, said wire bond connected to said topside;
- an underside having an exposed surface of conductive material, said underside disposed upon and coupling to said cathode;
- electro-static discharge protection circuitry extending from said topside, said protection circuitry coupled to said topside in the region where said first terminal is connectable;
- and
- a pass-through interconnect electrically coupling said topside with said underside through said sub-mount, said pass-through interconnect further electrically coupling said second terminal of said light emitting diode device with said cathode when said second terminal is connected to said topside, wherein said pass-through interconnect is formed by contiguous p regions.
Dependencies are inferred from the claim text.