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US 6,642,545 B2Granted
Semiconductor light emitting device
AssigneeRohm Co., Ltd.
InventorTadahiro Okazaki
Life of this patent
Estimating the term…
Abstract
A semiconductor light emitting device including a first semiconductor light emitting chip in which a first semiconductor light emitting layer is formed on a first substrate, a second semiconductor light emitting chip in which a second semiconductor light emitting layer is formed on a second substrate, and a bonding material for bonding the first semiconductor light emitting chip and the second semiconductor light emitting chip to each other in a stacked state.
Claims21
A semiconductor light emitting device, comprising:
- a first semiconductor light emitting chip in which a first semiconductor light emitting layer is formed on a first substrate,
- a second semiconductor light emitting chip stacked on and bonded to the first semiconductor light emitting chip, in which a second semiconductor light emitting layer is formed on a second substrate, and
- an insulating substrate having external connection electrodes on one surface thereof, wherein
- a stacked structure of the first and second semiconductor light emitting chips are mounted on the one surface of the insulating substrate, the first semiconductor light emitting chip having electrodes on the surface thereof on the opposite side of the second semiconductor light emitting chip, the electrodes being bump-bonded to the external connection electrodes and,
- in which the second semiconductor light emitting chip has electrodes on the surface thereof, and the electrodes are wire-bonded to the external connection electrodes.
2 more elements
A semiconductor light emitting device, comprising:
- a first semiconductor light emitting chip in which a first semiconductor light emitting layer is formed on a first substrate,
- a second semiconductor light emitting chip stacked on and bonded to the first semiconductor light emitting chip, in which a second semiconductor light emitting layer is formed on a second substrate, and
- an insulating substrate having external connection electrodes on one surface thereof, wherein
- a stacked structure of the first and second semiconductor light emitting chips are mounted on the one surface of the insulating substrate, the first semiconductor light emitting chip having electrodes on the surface thereof on the opposite side of the second semiconductor light emitting chip, the electrodes being bump-bonded to the external connection electrodes and
- in which the external connection electrodes are extended to the other surface of the insulating substrate, and connected to mounting electrodes for mounting the semiconductor light emitting device on a wiring substrate.
2 more elements
A semiconductor light emitting device, comprising:
- a first semiconductor light emitting chip in which a first semiconductor light emitting layer is formed on a first substrate,
- a second semiconductor light emitting chip stacked on and bonded to the first semiconductor light emitting chip, in which a second semiconductor light emitting layer is formed on a second substrate, and
- an insulating substrate having external connection electrodes on one surface thereof, wherein
- a stacked structure of the first and second semiconductor light emitting chips are mounted on the one surface of the insulating substrate, the first semiconductor light emitting chip having electrodes on the surface thereof on the opposite side of the second semiconductor light emitting chip, the electrodes being bump-bonded to the external connection electrodes and
- in which the external connection electrodes are extended to the other surface of the insulating substrate, and connected to mounting electrodes for mounting the semiconductor light emitting device on a wiring substrate.
2 more elements
Dependencies are inferred from the claim text.