Multiple pass write method and reticle
AssigneeMicron Technology, Inc.
InventorEugene A. DeLaRosa
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Abstract
A multiple pass write method and a reticle made from the method are described. A reticle preform is provided including a transparent substrate, a metal layer, and a layer of a photoresist material. In a first write pass, a first portion of the photoresist material is exposed by an electron beam device. Then, in a second write pass, a second portion of the photoresist material is exposed. The first exposed portion is smaller or has finer dimensions than the second exposed portion. The exposed portions of photoresist material are removed, and the unexposed portions of photoresist serve as a mask. The uncovered portions of the conductive layer are etched. Further, the unexposed portions of the photoresist material are removed, creating a reticle through a multiple write pass strategy.
Claims5
An apparatus for forming a photolithography device comprising:
- a device for projecting electrons at a layer of photoresist material;
- a controller for controlling the device such that multiple write passes based upon corresponding patterns sequentially expose portions of the photoresist material;
- and
- a database storing a first pattern corresponding to a first exposure area on the photoresist material and a second pattern corresponding to a second exposure area on the photoresist material, said second exposure area being larger than and adjacent to said first exposure area;
- wherein said first pattern and said second pattern are arranged such that if a buildup of electrostatic charge on the photoresist material occurs after exposure of said first exposure area and during exposure of said second exposure area, resulting in a deviation of electrons being projected from said projecting device, inaccurate exposure of the photoresist material is substantially avoided due to prior exposure of said first exposure area for which said first pattern corresponds.
Dependencies are inferred from the claim text.