Alignment mark detection method, and alignment method, exposure method and device, and device production method, making use of the alignment mark detection method

A device manufacturing method comprising the steps of:

• illuminating, using an illumination optical system, a reflection mask by light from a light source;
• projecting, using a projection optical system having an even number of mirrors, a pattern of the reflection mask onto a wafer in order to expose the wafer to the pattern;
• detecting an alignment mark of the reflection mask using a first alignment optical system;
• detecting an alignment mark of the wafer, using a second alignment optical system, wherein the conditions of detecting the alignment mark of the wafer are changeable;
• and
• developing the exposed wafer.

An exposure apparatus comprising:

• an illumination optical system for illuminating a reflection mask by X-rays from an X-ray source;
• A projection optical system for projecting a pattern of the reflection mask onto a wafer;
• a first alignment optical system for detecting an alignment mark of the reflection mask;
• a second alignment optical system for detecting an alignment mask of the wafer, and the conditions of detecting the alignment mark of the wafer are changeable;
• a mask stage for mounting the reflection mask;
• and
• a wafer stage for mounting the wafer,
• wherein the wafer is exposed to the pattern while scanning the reflection mask and the wafer.

An exposure apparatus comprising:

• an illumination optical system for illuminating a reflection mask by X-rays from an X-ray source;
• a projection optical system for projecting a pattern of the reflection mask onto a wafer;
• a first alignment optical system for detecting an alignment mark of the reflection mask;
• a second alignment optical system for detecting an alignment mark of the wafer, and the conditions of detecting the alignment mark of the wafer are changeable;
• a mask stage for mounting the reflection mask;
• a wafer stage for mounting the wafer,
• wherein the mounting surface of the mask stage and the mounting surface of the wafer stage face each other.