System and method for mounting electronic components onto flexible substrates
AssigneeVisteon Global Technologies, Inc.
InventorsLakhi N. Goenka, Peter Joseph Sinkunas
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Abstract
A system and method for reflowing solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder, and a pallet for supporting the substrate, wherein the supplemental heat source creates a stream of hot gas that flows transversely across the substrate.
Claims33
A system for reflowing solder to interconnect a plurality of electronic components to a substrate, the system comprising:
- an oven for preheating the substrate and the plurality of electronic components disposed thereon;
- a supplemental heat source positioned within the oven for providing additional heat energy to reflow the solder, wherein the supplemental heat source creates a stream of hot gas that flows transversely across the substrate;
- and
- a pallet for supporting and absorbing heat from the substrate.
A method for reflowing solder to interconnect a plurality of electronic components to a substrate, the method comprising:
- inserting the substrate into an oven;
- preheating the substrate and the plurality of electronic components disposed thereon;
- providing additional heat energy to reflow the solder using a supplemental heat source positioned within the oven;
- creating a stream of hot gas using the supplemental heat source, wherein the gas flows transversely across the substrate;
- and
- supporting the substrate with a pallet, wherein the pallet absorbs heat from the substrate.
Dependencies are inferred from the claim text.