Back to results
US 6,642,479 B2Granted
Laser cutting machine and method
AssigneeTrumpf GmbH & Co.
InventorHans Klingel
Life of this patent
Estimating the term…
Abstract
A machine and a process for thermal cutting of workpieces has at least one workpiece support (8) for the workpiece, at least one thermal cutting device (2), and at least one machine device (10, 11) to move the workpiece support (8) and the cut product adhering to the workpiece support (8) after the workpiece is cut relative to at least one stop (10) to loosen cut product adhering to the workpiece support (8).
Claims10
In a process for thermal cutting of workpieces, the steps comprising:
- (a) placing a workpiece on a workpiece support of a thermal cutting machine including a computer control for effecting relative movement of a thermal cutting tool and said workpiece;
- (b) effecting relative movement between said thermal cutting tool and said workpiece by said computer control to thermally cut said workpiece on said workpiece support to produce free cut product (10) freely resting on said workpiece support (8) and cut product adhered to said workpiece support;
- and
- (c) effecting relative movement between said adhered cut product and a stop to cause said adhered cut product and stop to abut with an impact of a magnitude sufficient to break the adhesion of said cut product and free it from the workpiece support.
1 more element
Dependencies are inferred from the claim text.