Porous para-oriented aromatic polyamide film, prepreg thereof, and base substrate for printed circuit board
AssigneeSumitomo Chemical Company, Limited
InventorsYasuo Shinohara, Tsutomu Takahashi
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Abstract
Provided is a porous para-oriented aromatic polyamide film which contains fine particles composed of a heat-resistant resin in an amount of 10 to 400 parts by weight based on 100 parts by weight of a pare-oriented aromatic polyamide and has a linear thermal expansion coefficient at 200 to 300° C. of from −50×10−6/° C. to +50×10−6/° C. The porous para-oriented aromatic polyamide film shows excellent tear propagation resistance and has light weight and low linear thermal expansion coefficient, and is suitable as a prepreg material used for a base substrate for printed circuit board.
Claims9
A porous para-oriented aromatic polyamide film which contains fine particles composed of a heat-resistant resin in an amount of 10 to 400 parts by weight based on 100 parts by weight of a pare-oriented aromatic polyamide and has a linear thermal expansion coefficient at 200 to 300° C. of from −50×106/° C. to +50×10−6/° C.
Dependencies are inferred from the claim text.