Organosilicon composition
AssigneeDow Corning Corporation
InventorLucrece De Ridder
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Abstract
The present invention relates to use of an inhibitor compound in an organosilicon composition for inhibiting curing of the organosilicon composition by a hydrosilylation reaction at a temperature of 40° C. to 100° C., or 100° C. and above, and a pressure of 1×106 N/m2 to 5×106 N/m2, or 5×106 N/m2 and above. In a preferred application the organosilicon composition cures to form a silicone gel or elastomeric seal or plug within an oil or gas well. Preferred inhibitor compound is 1-ethynyl-1-cyclopentanol or 1-ethynyl-1-cyclohexanol.
Claims7
A process for forming a silicone gel or elastomeric seal or plug within an oil or gas well by curing an organosilicon composition at a temperature of at least 40° C. and a pressure of at least 1×106 N/m2 by a hydrosilylation reaction, characterised in that an inhibitor compound is incorporated in the organosilicon composition to inhibit curing of the organosilicon composition en route to the desired location.
Dependencies are inferred from the claim text.