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US 6,642,142 B2Granted
Substrate cleaning method and method for producing an electronic device
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsToshihiko Nagai, Hiroshi Tanaka, Naoki Yokoi, Yasuhiro Asaoka, Seiji Muranaka
Life of this patent
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Abstract
In a water rinsing process performed after the surface of a substrate has been cleaned using a cleaning solution, a first spinning process, in which water is supplied to the surface of the substrate while the substrate is rotated at a first rotation speed, and a second spinning process, in which the substrate is rotated at a second rotation speed that is higher than the first rotation speed, are repeatedly performed alternately.
Claims15
A substrate cleaning method, comprising steps of
- cleaning a surface of a processed substrate using a cleaning solution,
- rinsing the surface of the processed substrate with water after the processed substrate has been cleaned, and
- drying the rinsed processed substrate,
- wherein the step of rinsing the surface of the processed substrate includes a step of having a first spinning process, where the processed substrate is rotated at a first rotation speed and water is simultaneously supplied to the surface of the processed substrate, and a second spinning process, where the processed substrate is rotated at a second rotation speed that is higher than the first rotation speed and water is simultaneously supplied to the surface of the processed substrate, repeatedly performed alternately by a same spin cleaner, and
- wherein the step of drying the rinsed processed substrate is performed after the step of repeatedly and alternately performing the first spinning process and the second spinning process.
2 more elements
A substrate cleaning method, comprising steps of
- cleaning a surface of a processed substrate using a cleaning solution,
- rinsing the surface of the processed substrate with water after the processed substrate has been cleaned, and
- drying the rinsed processed substrate,
- wherein the step of rinsing the surface of the processed substrate includes a step of having a first spinning process, where the processed substrate is rotated at a first rotation speed and water is simultaneously supplied to the surface of the processed substrate, and a second spinning process, where the processed substrate is rotated at a second rotation speed that is higher than the first rotation speed without water being supplied to the surface of the processed substrate, repeatedly performed alternately by a same spin cleaner and
- wherein the step of drying the rinsed processed substrate is performed after the step of repeatedly and alternately performing the first spinning process and the second spinning process.
2 more elements
Dependencies are inferred from the claim text.