Semiconductor device and manufacturing method thereof

A method of manufacturing a semiconductor device comprising the steps of:

• (a) preparing a structure having a semiconductor chip, a wiring substrate and an elastic layer, the semiconductor chip having a plurality of semiconductor elements and a plurality of external terminals formed on a main surface thereof, the wiring substrate including a plurality of wirings, the wiring substrate and the elastic layer protruding beyond an outer edge of the main surface of the semiconductor chip, and the elastic layer being positioned between the wiring substrate and the main surface of the semiconductor chip in a thickness direction of the semiconductor chip,
• wherein, the step (a) further contains a step of forming the elastic layer by printing;
• (b) electrically connecting the plurality of wirings with the plurality of external terminals, respectively;
• and
• (c) after the step (b), cutting the wiring substrate together with the elastic layer to form peripheral edges thereof, respectively, outside of the outer periphery of the semiconductor chip.