Chip-on-chip interconnections of varied characterstics
AssigneeInternational Business Machines Corporation
InventorsThomas George Ference, Wayne John Howell, Edmund Juris Sprogis
Life of this patent
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Abstract
Chip-on-chip interconnections of varied characteristics, such as varied diameters, heights and/or composition, are disclosed. A first chip-on-chip interconnection on a joining plane has a first characteristic (e.g., a first height) and a second chip-on-chip interconnection on the same joining plane has a second characteristic (e.g., a second height greater than the first height). The first and second characteristics of the chip-on-chip interconnections allow for chip-on-chip connections to other packages, substrates or chips of different levels and/or compositions.
Claims21
A method for joining chip-on-chip assemblies of different diameters, heights and levels comprising the steps of:
- a) fabricating a first interconnection having a first characteristic to connect a first chip and a substrate;
- b) fabricating a second interconnection having a second characteristic to connect said first chip and a second chip on a joining plane of said first interconnection;
- and
- c) joining said first chip to said substrate, and said second chip between said first chip and said substrate by reflowing said first and second interconnections.
A method of forming a chip-on-chip assembly, comprising:
- forming a first solder bump interconnection, having a first height, between a first chip and a second chip;
- and
- forming a second solder bump interconnection, having a second height, wherein the second height is different from the first height, between said first chip and a substrate on a joining plane of said first solder bump interconnection.
A method of forming a chip-on-chip interconnections having different characteristics, comprising:
- placing a mask over a chip;
- defining a first opening over a first pad of said chip;
- plating a first material into said first opening;
- defining a second opening over a second pad of said chip;
- plating a second material into said first and second opening to form a first and a second interconnection;
- stripping said plating mask;
- and
- reflowing said first and second interconnections.
Dependencies are inferred from the claim text.