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AssigneeTranspo Electronics, Inc.
InventorsBahman Roozrokh, Michael E. Fischer
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A method of manufacturing a diode assembly used in rectifier assemblies of engine-driven generators is disclosed. The diode assemblies have diode cups, semiconductor diode dies and diode leads fitted therein. The diode subassemblies are reflow soldered, such that the semiconductor diode die and diode lead are reflow soldered within a diode cup in an argon/hydrogen atmosphere. In another aspect of the present invention, a lead loader having a removable lead holder that holds diode leads therein is positioned over a diode boat such that the diode leads are aligned with respective diode cups. The lead holder is slid from the lead loader so that the diode leads fall into the center cups which also have the semiconductor die positioned therein. The diode boat is inserted within a furnace for reflow soldering.
A method of manufacturing a diode subassembly used in rectifiers of engine-driven generators, wherein the diode assembly includes a diode cup and semiconductor diode die and diode lead fitted therein, comprising the step of:
A method of manufacturing a diode subassembly used in rectifiers of engine-driven generators, wherein the diode assembly includes a diode cup, semiconductor diode die, and diode lead fitted therein, comprising the step of:
Dependencies are inferred from the claim text.