Light-emitting element, semiconductor light-emitting device, and manufacturing methods therefor

A method of manufacturing a flip-chip semiconductor light-emitting device, the device comprising:

• a semiconductor light-emitting element having a semiconductor multilayer film formed on a transparent substrate and p-side and n-side electrodes formed on a surface of said semiconductor multilayer film;
• a submount element having at least two independent electrodes;
• and a base capable of supporting said submount element and supplying electric power to said submount element, said submount element being mounted on said base to be electrically conductive to said base, said semiconductor light-emitting element being mounted in a face-down configuration on a top face of said submount element,
• the method comprising:
• a step of forming microbumps on the electrodes of either one of said semiconductor light-emitting element and said submount element;
• and
• a chip bonding step of bonding the p-side and n-side electrodes of said semiconductor light-emitting element to said electrodes of said submount element via said microbumps.