Method for producing a fiber optic switch

A method for forming a micro-optical switch, comprising:

• providing a first semiconductor substrate having a surface;
• integrating a VCSEL device in the first semiconductor substrate at a site;
• forming on the first semiconductor substrate surface at the site of the VCSEL device a first pedestal of microlens material extending from the surface of the first semiconductor substrate and having a top surface spaced apart from the first semiconductor substrate surface;
• providing a printhead containing an optical fluid which is hardenable and capable of serving as a micro-optical element, the printhead having an orifice from which micro-droplets of the optical fluid are ejected in response to control signals;
• depositing optical fluid onto the top surface of the first pedestal to thereby form a micro-optical element on the first pedestal;
• providing a second semiconductor substrate having a surface;
• integrating a PD diode in the second semiconductor substrate at a site;
• forming on the second semiconductor substrate surface at the site of the PD diode a second pedestal of microlens material extending from the surface of the second semiconductor substrate and having a top surface spaced apart from the second semiconductor substrate surface;
• providing the printhead containing an optical fluid which is hardenable and capable of serving as a micro-optical element, the printhead having an orifice from which micro-droplets of the optical fluid are ejected in response to control signals;
• depositing optical fluid onto the top surface of the second pedestal to thereby form a micro-optical element on the second pedestal;
• providing an integrated circuit having a third semiconductor substrate having a surface, the integrated circuit including a laser driver, an amplifier and switching circuitry interconnecting the laser driver and amplifier;
• connecting the VCSEL device to the third semiconductor substrate for contact with the laser driver;
• and
• connecting the PD diode to the third semiconductor substrate for contact with the amplifier.