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US 6,642,064 B1Granted
Method of making a high density programmable logic device in a multichip module package
AssigneeAltera Corporation
InventorsRichard S. Terrill, Donald F. Faria
Life of this patent
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Abstract
A high performance single package multi-chip module multiplies the logic density of the highest density monolithic programmable logic device (PLD). A dual-sided substrate carries multiple prepackaged PLDs on a top side and a field programmable interconnect (FPIC) die on a bottom side. The prepackaged PLDs and the ability to use the substrate as a burn-in vehicle for the FPIC die results in reliable and reworkable assembly process with minimized yield loss.
Claims3
A method for assembling a programmable logic apparatus comprising the steps of:
- (a) attaching a field programmable interconnect (FPIC) die to a bottom side of a substrate;
- (b) performing a burn-in test on the FPIC die as attached on the substrate;
- (c) mounting a plurality of prepackaged programmable logic devices (PLDs) on a top side of the substrate;
- and
- (d) testing the prepackaged PLDs.
2 more elements
Dependencies are inferred from the claim text.