Acetylenic diol surfactant solutions and methods of using same
AssigneeAir Products and Chemicals, Inc.
InventorsPeng Zhang, Danielle Megan King, Eugene Joseph Karwacki, Leslie Cox Barber
Life of this patent
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Abstract
Aqueous solutions comprising one or more acetylenic diol type surfactants are used to improve the wettability of a substrate surface by lowering the contact angle of the aqueous developer solution are enclosed herein. In one embodiment, the aqueous solution is used to prepare the surface of the substrate prior to development of the resist coating layer.
Claims19
A method for improving the wettability of a substrate, the method comprising:
- contacting the substrate with an aqueous solution comprising about 10 ppm to about 10,000 ppm of at least one surfactant having the formula (I) or (II):
- wherein R1 and R4 are a straight or a branched alkyl chain having from 3 to 10 carbon atoms;
- R2 and R3 are either H or an alkyl chain having from 1 to 5 carbon atoms;
- and m, n, p, and q are numbers that range from 0 to 20;
- coating the substrate with a resist coating to provide a resist-coated substrate;
- exposing at least a portion of the resist-coated substrate to a radiation source for a time sufficient to provide a pattern on the resist coating;
- and
- applying an aqueous developer solution to the substrate to dissolve at least a portion of the resist coating wherein the contacting step is conducted prior to the applying step.
A method for improving the wettability of a sustrate, the method comprising:
- contacting the substrate with an aqueous solution comprising about 10 ppm to about 10,000 ppm of at least one surfactant having the formula (I) or (II):
- wherein R1 and R4 are a straight or a branched alkyl chain having from 3 to 10 carbon atoms;
- R2 and R3 are either H or an alkyl chain having from 1 to 5 carbon atoms;
- and m, n, p, and q are numbers that range from 0 to 20;
- coating the substrate with a resist coating to provide a resist-coated substrate;
- exposing at least a portion of the resist-coated substrate to a radiation source for a time sufficient to provide a pattern on the resist coating;
- and
- applying an aqueous developer solution to the substrate to dissolve at least a portion of the resist coating
- wherein the contacting step is performed before the coating step.
A method for improving the wettability of a substrate, the method comprising:
- contacting a substrate with an aqueous solution comprising about 10 ppm to about 10,000 ppm of at least one surfactant having the formula:
- wherein R1 and R4 are a straight or a branched alkyl chain having from 3 to 10 carbon atoms;
- R2 and R3 are either H or an alkyl chain having from 1 to 5 carbon atoms;
- and m, n, p and q are numbers that range from 0 to 20;
- coating the substrate with a resist coating to provide a resist-coated substrate;
- exposing at least a portion of the resist-coated substrate to a radiation source for a time sufficient to provide a pattern on the resist coating;
- and
- applying an aqueous developer solution to the substrate to dissolve at least a portion of the resist coating wherein the contacting step is conducted prior to the applying step.
A method for improving the wettability of a substrate by reducing a contact angle of an aqueous developer solution on the surface of the substrate, the method comprising:
- contacting the substrate with an aqueous solution comprising about 10 ppm to about 10,000 ppm of at least one surfactant having the formula (I) or (II):
- wherein R1 and R4 are a straight or a branched alkyl chain having from 3 to 10 carbon atoms;
- R2 and R3 are either H or an alkyl chain having from 1 to 5 carbon atoms;
- and m, n, p, and q are numbers that range from 0 to 20;
- coating the substrate with a resist coating to provide a resist-coated substrate;
- exposing at least a portion of the resist-coated substrate to a radiation source for a time sufficient to provide a pattern on the resist coating;
- contacting the resist-coated substrate with the aqueous solution;
- and
- applying an aqueous developer solution to the substrate to dissolve at least a portion of the resist coat wherein the first and the second contacting steps are conducted prior to the applying step.
A method for improving the wettability of an aqueous developer solution on a surface of a resist-coated substrate, the method comprising:
- providing an aqueous solution comprising about 10 ppm to about 10,000 ppm of at least one surfactant having the formula (I) or (II):
- wherein R1 and R4 are a straight or a branched alkyl chain having from 3 to 10 carbon atoms;
- R2 and R3 are either H or an alkyl chain having from 1 to 5 carbon atoms;
- and m, n, p, and q are numbers that range from 0 to 20;
- contacting the resist-coated substrate with the aqueous solution;
- and
- applying the aqueous developer solution to the resist-coated substrate wherein the contacting step is conducted prior to the applying step.
Dependencies are inferred from the claim text.